300mm再生晶圓產業未來挑戰與因應之道-以中國砂輪為例

dc.contributor陳文華zh_TW
dc.contributorChen, Wun-Hwaen_US
dc.contributor.author鄭天棋zh_TW
dc.contributor.authorCheng, Tien-Chien_US
dc.date.accessioned2019-09-03T10:02:00Z
dc.date.available不公開
dc.date.available2019-09-03T10:02:00Z
dc.date.issued2018
dc.description.abstract半導體技術不斷朝高集積度、高性能、低成本與系統化發展的結果,促使半導體的應用已逐漸超越傳統3C(電腦、通訊、消費)領域,跨入物聯網、智能汽車、人工智慧、智能工廠等新興市場,為半導體產業發展帶來新機遇,使得半導體產業在全球的經濟地位更形鞏固。 半導體有相當多道的製程,每道製程都需經過測試、監控來確保製程品質與產品生產良率。測試晶圓是由晶棒所切割的晶圓片中,頭尾兩端所產出(所切割)的晶圓,出現的瑕疵相較於生產用晶圓多;為了節省成本,會將所使用過的測試晶圓經由腐蝕、輪磨及拋光等製程使晶圓可重覆使用;除了降低成本外,也可以降低對於環境所造成的污染。這種經由一連續的製程加工,使晶圓能夠重覆使用,所產出的晶圓片稱之再生晶圓(Reclaim Wafer)。 隨半導體蓬勃發展,以及中國半導體市場的崛起,300mm(12吋)再生晶圓產業也在此時再次達到高峰;但也隨著長期以來市場的起伏波動,再生晶圓產業更應該審慎在巔峰時刻評估未來動向。因此透過此研究探討,針對再生晶圓產業進行分析,觀察中國市場改變全球半導體供應鏈型態,並以中國砂輪為個案研究目的對象,做出其研究結論,與中國市場保持合作創造雙贏,持續創新提高產業門檻,亦或者轉型其他更利基型產品,以提升市場競爭力。zh_TW
dc.description.abstractSemiconductor technology continues toward high concentration, high performance, low cost and systematic development of the results, so the semiconductor applications have gradually surpassed the traditional 3C(computer, communications ,consumer)areas, and get into the Internet of things, smart cars, artificial intelligence, intelligence factories and other emerging markets, bringing new opportunities for the development of the semiconductor industry, making the semiconductor industry in the global economic status more consolidated. There are a few semiconductor processes, each process needs to be tested and monitored to ensure process quality and product yield. The test wafer is a wafer produced both ends of the wafer sliced by the ingot, with more defects in the wafer than in the production wafer; in order to save costs, the used test wafers are reusable through processes such as etching, wheel grinding and polishing. In addition to reducing costs, they also reduce the environmental impact. This kind of wafers can be reused through continuous processing and the resulting wafer is called "Reclaim Wafer". With the booming semiconductor industry and the rise of China's semiconductor market, the 12inch Reclaimed Wafer industry peaked again at this time. However, with the long-term ups and downs in the market, the Reclaimed Wafer Industry should be cautious at its peak assess future trends.Therefore, through the research and discussion, the paper analyzes the reclaimed wafers industry, observes the change of the global semiconductor supply chain in the Chinese market, and takes the case as the research object, makes its research conclusion, and maintains cooperation with China to create a win-win situation and continuously innovate to improve the industry The threshold, or the transformation of other more niche products, in order to enhance market competitiveness.en_US
dc.description.sponsorship高階經理人企業管理碩士在職專班(EMBA)zh_TW
dc.identifierG0104590182
dc.identifier.urihttp://etds.lib.ntnu.edu.tw/cgi-bin/gs32/gsweb.cgi?o=dstdcdr&s=id=%22G0104590182%22.&%22.id.&
dc.identifier.urihttp://rportal.lib.ntnu.edu.tw:80/handle/20.500.12235/94917
dc.language中文
dc.subject矽晶圓zh_TW
dc.subject再生晶圓zh_TW
dc.subject半導體產業zh_TW
dc.subject持續創新zh_TW
dc.subjectsilicon waferen_US
dc.subjectreclaimed waferen_US
dc.subjectsemiconductor industryen_US
dc.subjectcontinuous innovationen_US
dc.title300mm再生晶圓產業未來挑戰與因應之道-以中國砂輪為例zh_TW
dc.titleFuture Challenges and Competitive Strategies of the 300mm Silicon Wafer Reclaim Industry-A Case Study of KINIK Companyen_US

Files

Collections