摻雜之二硫化硒層狀材料在作為場效應電晶體通道對降低源/汲極接觸電阻之研究
dc.contributor | 李敏鴻 | zh_TW |
dc.contributor | 鍾朝安 | zh_TW |
dc.contributor | Lee, Min-Hung | en_US |
dc.contributor | Jong, Chao-An | en_US |
dc.contributor.author | 黃紹嘉 | zh_TW |
dc.contributor.author | HUANG, Shao-Jia | en_US |
dc.date.accessioned | 2019-09-04T01:27:49Z | |
dc.date.available | 不公開 | |
dc.date.available | 2019-09-04T01:27:49Z | |
dc.date.issued | 2016 | |
dc.description.abstract | 近幾年,過渡金屬硫屬化合物因為具有能隙關係,比同樣具有二維結構的石墨烯更適合用在電晶體元件製作,因此吸引很研究學者的興趣。其中WSe2是屬於P型的半導體更特別引人關注,然而一直缺乏一個穩定可控制的摻雜技術,難度頗高。本篇將開發一個穩定可行的摻雜製程,利用共濺鍍製程技術加上後硒化處理。希望用這個方法能夠讓電晶體的載子濃度及載子遷移率提升,讓通道電阻及接觸電阻有效的降低。 | zh_TW |
dc.description.abstract | Recently, two dimensional transition metal dichalcogenides (TMDs) compounds have drawn much interest due to their potential in TFT channel application than Graphene which without bandgap. Among these 2D materials, p-type WSe2 is particularly attractive. However, precise doping of WSe2 is difficult due to the absence of a controllable doping technique. In this paper, a controllable WSe2 doping method by co-sputtering process followed by post selenization treatment is demonstrated. Using this technique, high acceptor doping concentration and good hole mobility were obtained. Low sheet resistance and contact resistance were obtained. | en_US |
dc.description.sponsorship | 光電科技研究所 | zh_TW |
dc.identifier | G060348031S | |
dc.identifier.uri | http://etds.lib.ntnu.edu.tw/cgi-bin/gs32/gsweb.cgi?o=dstdcdr&s=id=%22G060348031S%22.&%22.id.& | |
dc.identifier.uri | http://rportal.lib.ntnu.edu.tw:80/handle/20.500.12235/97999 | |
dc.language | 中文 | |
dc.subject | 二硫化硒 | zh_TW |
dc.subject | 二硒化鎢 | zh_TW |
dc.subject | 二硫化鉬 | zh_TW |
dc.subject | 接觸電阻 | zh_TW |
dc.subject | 硒化 | zh_TW |
dc.subject | MoS2 | en_US |
dc.subject | WS2 | en_US |
dc.subject | WSe2 | en_US |
dc.subject | Contact Resistance | en_US |
dc.subject | Selenization | en_US |
dc.title | 摻雜之二硫化硒層狀材料在作為場效應電晶體通道對降低源/汲極接觸電阻之研究 | zh_TW |
dc.title | Study of Doping Layered-WSe2 Material as Field Effect Transistor Channel for Source/Drain Contact Resistance Reduction | en_US |